Apple will reportedly use a more advanced System on Integrated Chip (SoIC) technology for its M5 chips. SoIC technology allows for the stacking of chips in a three-dimensional structure. It provides better electrical performance and thermal management compared to traditional two-dimensional chip designs. Apple intends to start mass producing the chips in 2025 and 2026 for new Macs and AI cloud servers. The M5's dual-use design is believed to be part of Apple's plans to vertically integrate its supply chain for AI functionality across computers, cloud servers, and software.